Preparation Methods and Process Characteristics of Coated Glass

The performance advantages of coated glass stem from the precise construction of its functional thin films, a process that relies on various mature preparation technologies.Based on different film formation principles and process environments, mainstream preparation methods can be categorized into physical vapor deposition (PVD), chemical vapor deposition (CVD), and liquid phase deposition (LPD). Each method has its own characteristics in terms of film quality, production efficiency, and application adaptability, collectively forming the technological foundation for the large-scale and customized production of coated glass.

Physical vapor deposition (PVD) is currently the most widely used process route. Its core lies in transferring solid target atoms or molecules onto the glass surface to form a thin film. Among these, magnetron sputtering utilizes a magnetic field to confine high-energy ions in plasma to bombard the target, causing target atoms to sputter and deposit onto the glass substrate. This method allows for precise control of film thickness and composition, making it suitable for preparing metal, metal oxide, and composite multilayer films. The resulting films are uniform, dense, and have strong adhesion to the substrate, making them widely used in the production of Low-E glass and high-reflectivity glass. Vacuum evaporation vaporizes the film material through heating, which then condenses into a film in a vacuum environment. It boasts simple equipment and high deposition rates, but its ability to control the uniformity of complex compositions is relatively limited, making it primarily used for preparing single-metal or simple alloy films.

Chemical vapor deposition (CVD) is a process where a gaseous precursor reacts chemically on a glass surface to form a solid film. Atmospheric or low-pressure CVD can achieve large-area, uniform film formation at relatively low temperatures, making it particularly suitable for preparing dielectric films such as silicon dioxide and silicon nitride. However, the handling of reaction byproducts and the control of film stress require meticulous management. Plasma-enhanced chemical vapor deposition (PECVD) introduces plasma to activate the reaction, enabling the production of high-quality, high-adhesion films at low temperatures. It is commonly used for front-end coating in architectural glass and display devices.

Liquid-phase film formation methods include sol-gel methods and electroless plating. The sol-gel method uses precursors such as metal alkoxides to form a sol, which is then coated, dried, and heat-treated to form an oxide film. This method involves low processing temperatures and minimal equipment investment, making it suitable for preparing functional oxide films and composite coatings. However, it is slightly inferior to the vapor phase method in terms of large-area uniformity and film thickness accuracy. Chemical plating, on the other hand, precipitates a metal film on the glass surface through a reduction reaction in solution. It is simple to operate and is often used for preparing specific conductive or decorative films.

Regardless of the method used, the coating quality depends on the synergistic optimization of substrate pretreatment, atmosphere control, temperature management, and post-processing. To meet the optical, thermal, and durability requirements of different applications, multiple preparation technologies can be flexibly selected or combined to achieve a precise match between film structure and performance. With the development of advanced equipment such as pulsed magnetron sputtering and roll-to-roll continuous coating, the production efficiency and functional diversity of coated glass are continuously improving, laying a solid technological foundation for the in-depth application of high-performance glass in various industries.