Processing Revolution: The Shift To Ultrafast Lasers
Mar 31, 2026
On the manufacturing floor, a significant technological shift is underway in cutting and edging.
Traditional CNC grinding is increasingly being challenged by ultrafast laser solutions. The limitations of mechanical methods-micro-cracks, chipping, and heat-affected zones that compromise edge strength-are becoming critical pain points, especially for ultra-thin glass used in foldables and wearables.
In March 2026, GWEIKE launched its integrated ultrafast laser cutting platform, emphasizing the move toward non-thermal processing to achieve clean edges and reduce post-processing costs. Similarly, Beyond Laser has been promoting infrared femtosecond laser systems specifically for UTG (ultra-thin glass) processing, achieving near-zero heat-affected zones and micron-level precision for complex foldable screen contours.
This "cold processing" approach is becoming the benchmark for high-yield mass production in the foldable device segment.
