Industry Problem & Breakthrough: TGV Remains The Key Bottleneck

Regardless growing in electronic glass sector, significant technical hurdles remain.  The core process of glass substrates:Through Glass Via (TGV)-is still in a breakthrough and ramp-up phase.

Why TGV is difficult? TGV involves two main steps: Via formation and via filling. Via formation is gradually converging toward a "femtosecond laser-induced + wet etching" approach. However, achieving uniform copper plating during the filling stage remains a major challenge. Any voids in the plated copper can not only cause electrical failures but also lead to glass breakage under thermal stress.

Supply chain opportunities: Localization of TGV equipment is accelerating in China. Han's Laser is seen as the domestic leader in wafer-level TGV equipment. However, glass substrates (still dependent on foreign suppliers like Schott and Corning) and high-end inspection equipment remain weak links in the domestic supply chain.