BOE Forges New Strategic Partnership With Corning To Expand Footprint in Advanced Glass Business

Recently, BOE Technology Group entered a new strategic cooperation relationship with Corning for advance a range of emerging advanced glass buesinesses, to strengthen its foothold in next generation advanced materials.

In a May 20 evening filing, BOE announced it has signed a memorandum of understanding (MoU) with global specialty glass leader Corning. The partnership will focus on four key fields: glass-based packaging substrates, foldable glass, perovskite glass substrates, and optical interconnection applications.

The MoU remains valid for three years. Detailed terms and formal agreements for specific cooperative projects will be negotiated separately by both parties.

BOE also disclosed significant uncertainties surrounding its emerging businesses. Glass-based packaging substrates, perovskite products and optical interconnection solutions are yet to achieve mass production and commercial revenue, with ongoing technical and market risks remaining.

BOE initiated a 993 million CNY pilot line for glass-based packaging substrates in 2024. The firm has delivered prototype samples to domestic clients, several of which have passed concept verification and entered formal technical testing, paving the way for future mass production.

BOE's subsidiary started constructing a MicroLED chip production line in 2023. To date, its self-developed MicroLED optical interconnection chip samples have been completed and delivered to customers, supporting the company's layout in high-speed optical interconnection hardware.

Since 2024, BOE has invested nearly CNY 1 billion to build three full-scale R&D and pilot platforms for perovskite technology, including a 25mm×25mm glove box platform, a 300mm×300mm experimental line and a 1200mm×2400mm pilot line. The company is advancing rigid, flexible and stacked perovskite component technologies in parallel to drive breakthroughs in next-generation display and photovoltaic glass solutions.