Semiconductor Glass Substrate Enters Mass Production Trial, Driven By AI Chip Demand

In early 2026, major global manufacturers including Absolics and Samsung have launched mass production trials for semiconductor glass substrates, marking a critical shift in glass deep processing for high-tech industries. Fueled by the growing demand for AI chips and advanced packaging, glass substrates are replacing traditional organic substrates due to their superior flatness, thermal stability, and interconnect density. Absolics, a subsidiary of SKC, has completed equipment installation at its Georgia factory and begun supplying mass-produced samples to AMD for certification. Meanwhile, Samsung Electronics is testing glass substrates for next-generation HBM4 memory packaging to improve heat dissipation. Industry reports predict that semiconductor glass substrate shipments will grow at a CAGR of over 10% from 2025 to 2030, with demand in AI chip packaging soaring at a 33% CAGR.